Sensors

QuickSil builds wafers for use in a wide range of sensors including resistive pressure sensors. In cases where the customer wishes to receive fully processed sensor die QuickSil subcontracts the backside etching, bonding and saw operations.

Because the quality of many sensors depends on the ability to both maintain tight control of critical dimensions and reproducibility of diffusion schedules, we find that the combination of printing using steppers and our ability to accurately reproduce complex diffusion cycles frequently results in superior devices.

As part of the work associated with the manufacture of backside illuminated PIN Diodes, QuickSil is able to process relatively thin material which is helpful in some sensor applications (<350 μm).

In addition QuickSil has the technology to integrate the use of low temperature coefficient polysilicon resistors and low and controlled stress dielectric films into the manufacture of such sensors.