MEMS

QuickSil is involved in a number of aggressive MEMS, MIMS and MOMS programs and is presently building these devices for a number of customers. Because we have two Novellus Concept I reactors for depositing precision nitride and oxide PECVD films with controlled stress (this enables us to deposit thick films with these materials), in addition to LPCVD silicon Nitride, Polysilicon and LTO, we can easily build up the stacked structures heavily relied on in building MEMS structures.

In addition we have the capabilities to etch silicon as required.

In general we have been able to use Ultratechs for printing. We have found that these machines give a significant advantage in obtaining tightly device controlled parametrics when compared with similar devices printed using contact and proximity printing.