Laser Programmable MCM-D Substrate Technology

QuickSil and Prototype Solutions have worked together to offer two additional variations of the nC1000 MCM-D technology

The advantages of enabling the interconnect to be determined by laser programming include the use of one set of tooling (used to define the patterns on the substrates) for many designs. This reduces substantially the cost of substrates required for short production runs.

QS1020 Laser programmable two level metal interconnect

The QS1020 technology allows the manufacture MCM substrates using regular

interconnect patterns where the interconnects can be programmed using fusible links. These links can be shorted by a non critical laser pulse to form reliable low resistance paths. This allows laser programming to result in the required interconnects of the base MCM. The use of alternate metallization schemes to form the device pads is an option to improve the flexibility of these substrates.

The base QS1020 technology is as follows:

Silicon Substrate (125 mm diameter)

2 microns SiO2

2 microns M1 (Aluminum)

1.5 microns SiO2 Interlayer Dielectric

2 microns M2 (Aluminum)

1 micron SiO2 Passivation

QS1030 Laser programmable two level metal interconnect

The QS1030 technology is an extension of the QS1020 technology allowing the use of integrated capacitance, decoupled power, and ground planes. These planes are selected by shorting the laser programmable links at the same time as laser routing of the M1/M2 interconnect.

The base QS1030 technology is as follows:

Silicon Substrate (125 mm diameter)

0.8 microns SiO2

1 micron M1 (Aluminum)

Grow Alumina (Al2O3) Dielectric to give 50 nF/cm^2

1 micron M2 (Aluminum)

7 microns SiO2

2 microns M3 (Aluminum)

1.5 microns SiO2 Interlayer Dielectric.

2 microns M4 (Aluminum)

1 micron SiO2 Passivation