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We have always operated under the assumption that a wafer's quality is primarily dictated by the equipment used in its manufacture.
We have therefore worked to procure the best equipment possible and have expended maximum resources on the maintenance staff and the
maintenance of our equipment and facility.
Photomasking
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3 Ultratech UT 1000WF steppers
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2 Canon MPA/PLA-501FA proximity printers
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1 EV640 frontside/backside wafer aligner
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6 spin tracks/softbake
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3 developer baths
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4 autohandling microscopes
Thin Film
Dry Etch
Diffusion Tubes Bruce/GMI
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1 POCl3
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1 high temp furnace (1280°C)
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1 BBr3
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1 LPCVD Si3N4 (+ low stress)
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1 LPCVD polysilicon (+ amorphous)
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1 LPCVD SiO2 (+ PH3)
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5 oxidation furnaces
Gold Processing
Parametric Test
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1 Reedholm LOMAC RI-20 parametric tester
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1 Electroglas 2001X automated prober
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1 MicroManipulator station
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1 HP4140B picoammeter
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1 Materials Development Corporation CSM/2 C-V plotter
Other
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